IMP23ABSUTR Analog Bottom MEMS microphone for ultrasound applications

The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface.

The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.

The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio.

The sensitivity of the IMP23ABSU is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.

The IMP23ABSU is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

  • Single supply voltage operation 1.52 V - 3.6 V

  • Omnidirectional sensitivity

  • High signal-to-noise ratio

  • High acoustic overload point: 130 dBSPL typ.

  • Package compliant with reflow soldering

  • Enhanced RF immunity

  • Ultra-flat frequency response

  • Ultrasound bandwidth (up to 80 kHz)

  • Low latency

  • Ultra-low-power: 150 µA max.

  • ECOPACK, RoHS, and “Green” compliant